We introduce uncomplicated nanolitre (23 nL) and picolitre (3.5 pL) liquid volume encapsulation in Off-Stoichiometry Thiol-Ene-Epoxy polymer (OSTEmerTM322) wells using spontaneous room- temperature bonding of gold films to thiol and thioether groups present on the surface of the polymer for leak free sealing. First, we show liquid encapsulation within nL, and pL polymer wells by utilizing 100 nm thin Au-film transfer-bonding onto intermediately cured, and micropatterned OSTEmerTM322. This approach yielded 3 magnitude orders smaller liquid volume encapsulation than previously reported. Secondly, we show that encapsulated liquid can be stored for >116 h. Finally, we demonstrate encapsulated liquid release by thermopneumatic bursting. We conclude that OSTEmerTM322 is excellent for metal-film sealant integration in polymer microfluidic devices.
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